SEALING AGENT SOLUTION, AND SEALING METHOD USING THE SAME

Title:

SEALING AGENT SOLUTION, AND SEALING METHOD USING THE SAME

Document Type and Number:

Japanese Patent JP2012172190

Kind Code:

A

Abstract:

To provide a water-based sealing agent solution which does not contain organic solvents causing environmental pollution, is capable of carrying out a treatment without energization so as to respond to the treatment of a recent device with a small size and a high density, and is capable of carrying out the sealing treatment selectively and quantitatively to parts to be treated; and to provide a sealing method using the same.

The sealing agent solution for plating materials of noble metals or noble metal alloys includes: a nitrogen-containing five-membered cyclic compound having a mercapto group and not containing a benzene ring, as a first component; a linear alkane thiol having a carbon number of 10 or more and 20 or less, as a second component; and a nonionic surfactant, as a third component.

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Inventors:

SOGAWA AKIHIRO
NISHIMOTO YOSHIHIRO
YOSHIMOTO MASAKAZU

Application Number:

JP2011034739A

Publication Date:

September 10, 2012

Filing Date:

February 21, 2011

Export Citation:

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Assignee:

DAIWA FINE CHEMICALS CO LTD LAB

International Classes:

C23C26/00

Domestic Patent References:

JPH04243506A	1992-08-31
JP2000239868A	2000-09-05

Foreign References:

WO2005073435A1	2005-08-11
WO2009067446A1	2009-05-28

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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