Title:
SEALING EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH06199996
Kind Code:
A
Abstract:
PURPOSE: To obtain the subject molding material, comprising a reactional product of a silicone-modified resin with a mold release agent, excellent in metallic mold releasability, reliability of moisture resistance and imprinting properties and useful as electrical and electronic parts, etc.
CONSTITUTION: The objective molding material comprises preferably 0.1-10wt.% reactional product of a silicone-modified resin such as a silicone-modified epoxy resin with a mold release agent such as palmitic acid.
Inventors:
MIYATANI YOSHIHIRO
IKEDA KOJI
KAGAWA HIROHIKO
IKEDA KOJI
KAGAWA HIROHIKO
Application Number:
JP133793A
Publication Date:
July 19, 1994
Filing Date:
January 07, 1993
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JPH02168654A | 1990-06-28 | |||
| JPS59191755A | 1984-10-30 | |||
| JPS59191754A | 1984-10-30 |
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)