SEALING FILM FOR ELECTRONIC DEVICE

Japanese Patent JP3918887

B2

PROBLEM TO BE SOLVED: (J) To improve the sealing workability and adhesion to electronic devices by providing a heat- and/or light-curable adhesive layer composed primarily of an ethylene-vinyl acetate copolymer on one or both sides of a substrate film having a specific light transmittance and refractive index.
SOLUTION: To 100 pts.wt. of an ethylene-vinyl acetate copolymer containing 10-50 wt.% of vinyl acetate, are blended 0.1-10 pts.wt. of a photosensitizer, 0.1-10 pts.wt. of an organic peroxide having a decomposition temperature of 50°C or above at a half-life of 10 hours, 0.01-5 pts.wt. of a silane coupling agent, 0.1-50 pts.wt. of a (meth)acryloyl-containing compound and/or allyl-containing compound, and 1-200 pts.wt. of a hydrocarbon resin, so that a heat- and/or light-curable adhesive is obtained. The adhesive is applied on one or both sides of a substrate film having a light transmittance of 50% or more, a refractive index of 1.8 or less, a Young's modulus of 1 kg/cm2 or more and a thickness of 1-1,000 μm and cured to form an adhesive layer, on the surface of which unevenness with an average roughness of 50 μm are formed.

Yasumasa Morimura
Hideo Sugiyama
Hidefumi Kotsubo
Ryo Sakurai
Takahiro Matsuse
Kitano Tetsuo

JP19651097A

May 23, 2007

July 07, 1997

Click for automatic bibliography generation  

Bridgestone Corporation

B32B27/28; C09J7/02; C09J4/00; C09J123/08; C09J131/04; H01L23/29; H01L23/31; (IPC1-7): C09J7/02; B32B27/28; H01L23/29; H01L23/31

JP9129371A
JP9129369A
JP8293383A
JP6084700U
JP6070196U
JP5198374A
JP5101884A
JP5045520A
JP7153874A
JP6035575B2
JP58060579A

Takashi Kojima
Yuko Nishikawa

Previous Patent: ENTRANCE WATER-TIGHTENING DEVICE FOR SHIELD MACHINE

Next Patent: SEALING FILM FOR ELECTRONIC DEVICE