SEALING FILM FOR ELECTRONIC DEVICE

Japanese Patent JP3918889

B2

PROBLEM TO BE SOLVED: (J) To improve the sealing workability and adhesion to electronic devices by providing a heat- and/or light-curable adhesive layer composed primarily of a copolymer of ethylene, vinyl acetate and maleic acid (anhydride) on one or both sides of a substrate film having a specific light transmittance and refractive index.
SOLUTION: To 100 pts.wt. of a copolymer comprising ethylene, 10-50 wt.% of vinyl acetate and 0.01-10 wt.% of maleic acid (anhydride), are blended 0.1-10 pts.wt. of an organic peroxide having a decomposition temperature of 50°C or above at a half-life of 10 hours, 0.1-10 pts.wt. of a photosensitizer, 0.01-5 pts.wt. of a silane coupling agent, 0.1-50 pts.wt. of a (meth)acryloxy-containing compound and/or allyl-containing compound, and 1-200 pts.wt. of a hydrocarbon resin, so that a heat- and/or light-curable adhesive is obtained. The adhesive is applied on one or both sides of a substrate film having a light transmittance of 50% or more and a refractive index of 1.8 or less and cured to form an adhesive layer.

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JP3918888	SEALING FILM FOR ELECTRONIC DEVICE

Yasumasa Morimura
Hideo Sugiyama
Hidefumi Kotsubo
Ryo Sakurai
Takahiro Matsuse
Kitano Tetsuo

JP19651297A

May 23, 2007

July 07, 1997

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Bridgestone Corporation

B32B27/28; C09J7/02; C09J4/00; C09J123/08; C09J131/04; C09J135/00; H01L23/29; H01L23/31; (IPC1-7): C09J7/02; B32B27/28; H01L23/29; H01L23/31

JP9129371A
JP9129369A
JP8293383A
JP6084700U
JP6070196U
JP5198374A
JP5101884A
JP5045520A
JP9159822A

Takashi Kojima
Yuko Nishikawa

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