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Title:
SEALING MATERIAL COMPOSITION FOR CARD AND PREPARATION OF CARD USING THE SAME
Document Type and Number:
Japanese Patent JP2001072960
Kind Code:
A
Abstract:

To provide a sealing material composition which can give a card having the excellent adhesion between a substrate sheet and a cover sheet, little unevenness, moderate flexibility as well as high reliability, and to provide a process for preparing the card with the above characteristics using this sealing material composition.

A sealing material composition for cards contains (A) an ionizing radiation-polymerizable acrylate compound and (B) a multifunctional isocyanate of 1-40 pts.wt. based on 100 pts.wt. of (A) component and is to be cured by irradiation of an ionizing radiation. In addition, a card is prepared by interposing a coating layer 5 made of the sealing material composition between a substrate sheet 3 and a cover sheet 4 and by irradiating the ionizing radiation to thereby cure the coating layer.


Inventors:
NAKADA YASUKAZU
ICHIKAWA AKIRA
TAGUCHI KATSUHISA
IWAKATA YUICHI
Application Number:
JP24927499A
Publication Date:
March 21, 2001
Filing Date:
September 02, 1999
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
G06K19/07; C09J4/00; C09J4/02; C09J175/00; C09K3/10; G06K19/02; G06K19/077; H01L23/29; H05K3/28; (IPC1-7): C09K3/10; C09J4/00; G06K19/07
Attorney, Agent or Firm:
Uchiyama Mitsuru