Title:
SEALING COMPONENT
Document Type and Number:
Japanese Patent JP2016211735
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sealing component that prevents deformation of the sealing component and thus prevents generation of a gap at the site of the sealing component, thereby capable of enhancing reliability of a substrate treatment process.SOLUTION: A sealing component 100 comprises: a body part 110; a cooling part 111 comprising a flow channel through which a refrigerant moves inside the body part; and a first tube 120 and a second tube 130 in communication with the cooling part from at least one side of the body part. The refrigerant is supplied to the cooling part through the first tube, and discharged from the cooling part through the second tube.SELECTED DRAWING: Figure 2
Inventors:
LEE BYUNG IL
KANG HO YOUNG
YEOM HYUN JIN
KANG HO YOUNG
YEOM HYUN JIN
Application Number:
JP2016084689A
Publication Date:
December 15, 2016
Filing Date:
April 20, 2016
Export Citation:
Assignee:
TERA SEMICON CORP
International Classes:
F16J15/10
Attorney, Agent or Firm:
Hatta International Patent Corporation
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