Title:
SEALING OF RELAY MOUNTED ON PRINTED BOARD
Document Type and Number:
Japanese Patent JPH0547279
Kind Code:
A
Abstract:
PURPOSE: To provide a sealing method for a relay to be mounted on a printed board with which a height size can be restricted, and which provides an excellent sealing property.
CONSTITUTION: A terminal 2 protruding from a lower surface of a relay 1 is folded in a U-letter shape along its lower surface and side surfaces, and a seal part 3 is formed at the lower surface of the relay 1 by low-pressure moulding. Sealing agent can thus be filled sufficiently if an interval between a terminal part and the lower surface of a relay main body is very small.
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Inventors:
TAKEGAHARA IKUO
NODA MASAYUKI
NAKANISHI YOICHI
SATO RYUICHI
NODA MASAYUKI
NAKANISHI YOICHI
SATO RYUICHI
Application Number:
JP20174391A
Publication Date:
February 26, 1993
Filing Date:
August 12, 1991
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01H45/02; H01H45/04; H01H45/14; H01H49/00; (IPC1-7): H01H45/02; H01H45/04; H01H45/14; H01H49/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)
Next Patent: RELAY DEVICE