Title:
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
Japanese Patent JP2020122071
Kind Code:
A
Abstract:
To provide a sealing resin composition with which a cured product has a low dielectric loss tangent.SOLUTION: A sealing resin composition includes an epoxy resin, a curing agent including an active ester compound, and a non-polar polymer.SELECTED DRAWING: None
Inventors:
SAITO TAKAHIRO
BABA TORU
TANAKA MIKA
KODAMA SHUNSUKE
YAMAURA ITARU
BABA TORU
TANAKA MIKA
KODAMA SHUNSUKE
YAMAURA ITARU
Application Number:
JP2019014341A
Publication Date:
August 13, 2020
Filing Date:
January 30, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08K5/105; C08L45/02; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office