PURPOSE: To obtain a compound suitable for sealing a member including aluminum by a sealing resin compound for semiconductor obtained by compounding a silane coupling agent and thermosetting resin.

CONSTITUTION: A sealing resin compound for semiconductor is obtained by compounding a silane coupling agent expressed in a predetermined general formula, for example, an agent previously reacted vinyl trioxysilane under a reaction accelerator and thermosetting resin, for example, an agent previously reacted epoxy resin under a hardening agent. This compound serves as dampproofing and anticorrosion for a semiconductor device including Al in a member.