Title:
SEMICONDUCTIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH04216842
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. which decreases the amt. of small projections formed at the interface between an insulating layer and a semiconductive layer of a solid insulated cable when used as the semiconductive layer. CONSTITUTION:The title compsn. comprises a polymer material consisting of 90-60 pts.wt. ethylene-propylene robber and 10-40 pts.wt. uncured epoxy resin having a m.p. of 50-100 deg.C) and carbon black.
Inventors:
INOUE YOSHIYUKI
SEKIGUCHI YOITSU
SEKIGUCHI YOITSU
Application Number:
JP41216890A
Publication Date:
August 06, 1992
Filing Date:
December 18, 1990
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C08K3/04; C08G59/00; C08L23/16; C08L63/00; H01B1/24; (IPC1-7): C08K3/04; C08L23/16; C08L63/00; H01B1/24
Attorney, Agent or Firm:
Nishikawa Shigeaki