Title:
SEMICONDUCTOR ACCELERATION SENSOR
Document Type and Number:
Japanese Patent JP2790168
Kind Code:
B2
Abstract:
PURPOSE: To make miniaturization of a chip size possible and to provide a semiconductor acceleration sensor, which is superior in mass productivity.
CONSTITUTION: A sensor wafer 11 is jointed with upper and lower stopper wafers 21 and 31 at positions where the center positions of four electrode pads 13 arranged at the symmetrical positions of adjacent four sensor chips arranged on the sensor wafer 11 correspond to electrode extraction through holes 22 formed in the stopper 21. Thereby, the number of the holes 22 formed in the stopper wafer 21 can be significantly reduced per every wafer and an easy stopper processing process and a miniaturization of a chip can be achieved.
Inventors:
SUGIMOTO MITSUHIRO
Application Number:
JP5297395A
Publication Date:
August 27, 1998
Filing Date:
March 13, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
G01P15/125; H01L29/84; (IPC1-7): H01L29/84; G01P15/125
Domestic Patent References:
| JP5203669A | ||||
| JP6324077A | ||||
| JP59136941A | ||||
| JP475969U |
Attorney, Agent or Firm:
Yosuke Goto (2 outside)
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