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Patent Searching and Data


Title:
SEMICONDUCTOR ACCELEROMETER
Document Type and Number:
Japanese Patent JPH08145832
Kind Code:
A
Abstract:

PURPOSE: To improve the measuring accuracy of a semiconductor accelerometer.

CONSTITUTION: A semiconductor accelerometer is provided with an insulating plate 2 which is fixed and bonded to a semiconductor substrate 4 in a peripheral edge part 10 so that the semiconductor substrate 4 the central part of which generates a bend according to an acceleration and an electrode 8 which is situated in a position faced with the central part of the semiconductor substrate can be held. Cutouts 20 which absorb an inessential bend generated in the semiconductor substrate 4 and the insulating plate 2 are formed so that a thermal stress or a residual stress which is generated in the semiconductor substrate 4 and the insulating plate 2 can be absorbed on the side which is close to the electrode 8 from the peripheral edge part 10.


Inventors:
SUGIMOTO MASAHIRO
Application Number:
JP1994000289891
Publication Date:
June 07, 1996
Filing Date:
November 24, 1994
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
G01L9/12; G01P15/125; H01L29/84; (IPC1-7): G01L9/12; H01L29/84
Attorney, Agent or Firm:
吉田 研二 (外2名)