PURPOSE: To improve the measuring accuracy of a semiconductor accelerometer.

CONSTITUTION: A semiconductor accelerometer is provided with an insulating plate 2 which is fixed and bonded to a semiconductor substrate 4 in a peripheral edge part 10 so that the semiconductor substrate 4 the central part of which generates a bend according to an acceleration and an electrode 8 which is situated in a position faced with the central part of the semiconductor substrate can be held. Cutouts 20 which absorb an inessential bend generated in the semiconductor substrate 4 and the insulating plate 2 are formed so that a thermal stress or a residual stress which is generated in the semiconductor substrate 4 and the insulating plate 2 can be absorbed on the side which is close to the electrode 8 from the peripheral edge part 10.