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Title:
SEMICONDUCTOR APPARATUS, LED HEAD, AND IMAGE FORMING APPARATUS
Document Type and Number:
Japanese Patent JP2009147352
Kind Code:
A
Abstract:

To provide a semiconductor apparatus without separating a base insulating layer by an external force when dicing a semiconductor wafer, and to provide an LED head and an image forming apparatus using the semiconductor apparatus.

The semiconductor apparatus has a semiconductor thin film 20 and the wiring layer 51 of an integrated circuit constituting a light-emitting apparatus formed on the upper part of a semiconductor substrate 50. In the semiconductor apparatus, the semiconductor thin film is fixed to the base insulating layer 54 on the semiconductor substrate, and a side edge in the dicing position of the base insulating layer and an exposed portion on the substrate exposed from the base insulating layer are covered by a separation-preventing pattern 77.


Inventors:
FURUTA HIRONORI
OGIWARA MITSUHIKO
FUJIWARA HIROYUKI
IGARI YUUKI
MUTO MASATAKA
Application Number:
JP2009009296A
Publication Date:
July 02, 2009
Filing Date:
January 19, 2009
Export Citation:
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Assignee:
OKI DATA KK
OKI DIGITAL IMAGING CORP
International Classes:
H01L21/301; H01L33/00; H01L33/08; H01L33/30; H01L33/44; H01L33/58
Domestic Patent References:
JPS6344461U1988-03-25
JPS6260053U1987-04-14
JPH10284760A1998-10-23
JP2004179641A2004-06-24
JPS5834738U1983-03-07
Attorney, Agent or Firm:
Yukio Sato



 
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