Title:
SEMICONDUCTOR CHIP AND METHOD FOR DETECTING DISCONNECTION OF WIRE BONDED TO SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP2016145720
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of reducing the use of a tester when detecting disconnection of a wire wire-bonded to the same lead terminal.SOLUTION: A semiconductor chip 100 includes a first electrode pad 12a, a second electrode pad 12b, a first current detector and a third electrode pad 60. The first electrode pad 12a and the second electrode pad 12b are wire-bonded to the first lead terminal 30. The first current detector is connected between the first electrode pad 12a and the second electrode pad 12b. The third electrode pad 60 is wire-bonded to the second lead terminal 80. The first current detector has different output when an induced current flowing through a first closed circuit circulating the first lead terminal 30, the first electrode pad 12a, the first current detector and the second electrode pad 12b is more than a threshold value or less than the threshold value when an induced electromotive force generating current is energized to the third electrode pad 60.SELECTED DRAWING: Figure 1
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Inventors:
KAJIYAMA TARO
YAMANAKA KAZUSHI
YAMANAKA KAZUSHI
Application Number:
JP2015022068A
Publication Date:
August 12, 2016
Filing Date:
February 06, 2015
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
G01R31/28; G01R31/02; H01L21/60
Domestic Patent References:
| JPH09113566A | 1997-05-02 | |||
| JP2001041994A | 2001-02-16 | |||
| JP2009115719A | 2009-05-28 | |||
| JPH11111785A | 1999-04-23 | |||
| JP2005277201A | 2005-10-06 | |||
| JP2009025044A | 2009-02-05 | |||
| JP2006170878A | 2006-06-29 | |||
| JP2006071519A | 2006-03-16 |
Attorney, Agent or Firm:
Kaiyu International Patent Office
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