Title:
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2010225598
Kind Code:
A
Abstract:
To provide a semiconductor component which improves the reliability of connection between bumps and pads, and to provide a method of manufacturing a semiconductor device.
The semiconductor component 1, which is not connected to a pad 13 yet, includes a drum-shaped solder bump 6. The drum-shaped solder bump 6 can be connected to the pad 13, and is formed such that a contact surface to the pad 13 and a side face in the vicinity of the contact surface makes an acute angle. This improves the reliability of connection between the drum-shaped solder bump 6 and the pad 13.
Inventors:
OCHI YASUHIKO
Application Number:
JP2009067759A
Publication Date:
October 07, 2010
Filing Date:
March 19, 2009
Export Citation:
Assignee:
RENESAS ELECTRONICS CORP
International Classes:
H01L21/60
Attorney, Agent or Firm:
Ken Ieiri
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