半導体冷却装置

Japanese Patent JP7064989

B2

To alleviate a stress on an insulating substrate in a semiconductor cooling device in which a warp prevention plate having chipped parts is joined to a cooler.SOLUTION: A semiconductor cooling device 1 comprises: a cooler 20; a heat transfer layer 13 that is joined to a first surface 21a of the cooler 20; an insulating substrate 10 that is joined to the heat transfer layer 13 on the opposite side of the cooler 20, has a wiring layer 12 for mounting a semiconductor element laminated on a surface on the opposite side of the heat transfer layer 13; and a warp prevention plate 40 that is joined to a second surface 32a of the cooler 20, and is formed of a material having a coefficient of linear expansion smaller than that of a material of the cooler 20. The cooler 20 has elements 33a, 33b requiring exposure in a projection area obtained by projecting the insulating substrate 10 on the second surface 32a, and thus the warp prevention plate 40 has chipped parts 41 at positions corresponding to the elements 33a, 33b, and the heat transfer layer 13 has notches 14 at positions corresponding to the chipped parts 41 of the warp prevention plate 40.SELECTED DRAWING: Figure 2

WO/1994/017649	MOUNTING ASSEMBLY FOR POWER SEMICONDUCTORS
JP2023083262	COLD PLATE WITH EMBEDDED POWER DEVICE, DRIVER CIRCUIT, AND MICROCONTROLLER WITH 3D PRINTED CIRCUIT BOARD

Tomohiro Anzai
Seiji Matsushima

JP2018142072A

May 11, 2022

July 30, 2018

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SHOWA DENKO K.K.

H01L23/473; H01L23/36

JP2017098439A
JP2006294971A
JP2012169319A
JP2008294283A
JP2016225531A
JP2019220539A

US20080290498
CN101312168A

Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada

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