Title:
SEMICONDUCTOR CUTTING DEVICE
Document Type and Number:
Japanese Patent JPH0596529
Kind Code:
A
Abstract:
PURPOSE: To three-dimensionally grasp the state of an inner peripheral edge at the time of the cutting of an ingot and the cut cross-sectional shape of the cut ingot.
CONSTITUTION: Displacement sensors 10, 12, 14 measuring the displacement of an inner peripheral edge 6 in the thickness direction thereof are provided at the position opposed to the inner peripheral edge 6 along the peripheral direction of the inner peripheral edge 6 so as to hold a work (ingot) 8 during cutting between the edge 6 and the sensors.
More Like This:
| JP2000288900 | WORKING FLUID SUPPLY DEVICE FOR WIRE SAW |
| JP6779574 | Interposer manufacturing method |
Inventors:
TAKAHASHI HIROYUKI
Application Number:
JP17013391A
Publication Date:
April 20, 1993
Filing Date:
July 10, 1991
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B24B27/06; B23D59/00; B24B49/00; B28D5/02; H01L21/301; H01L21/304; (IPC1-7): B24B27/06; B24B49/00; B28D1/22; H01L21/304; H01L21/78
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
Next Patent: INNER PERIPHERAL EDGE TYPE SLICING MACHINE