To provide a semiconductor device analysis device for appropriately identifying causes for yield decreasing by eliminating the possibility in which the adherence to a model using a center axis of a wafer as a reference in a trend analysis of a characteristic value obtained from the wafer results in prejudice of an analyst to promote the trend analysis and a process improvement activity relating to the characteristic value of the wafer in which deviation from the center axis of the wafer is ignored (or improperly neglected.)

A semiconductor device analysis device includes: an approximate function generation unit for generating an approximate function obtained by modeling a characteristic value obtained from a wafer; an approximate function analysis unit for analyzing whether the approximate function includes an odd function or not; and a factor identification unit for identifying a defect factor corresponding to the odd function included in the approximate function on the basis of a feature of the approximate function.