To provide a semiconductor device or an electronic controller which is low cost and has an excellent heat dissipation characteristic.
The semiconductor device is provided with: a substrate 1 having an electronic circuit arranged on a first principal plane; a semiconductor element 6 mounted on the first principal plane of the substrate 1 and electrically connected with the electronic circuits by means of wire bonding 2; a metal core layer 1a provided inside the substrate and electrically connected with the semiconductor element 6; a plurality of conductive bumps 7 mounted on a second principal plane of the substrate 1, which is opposite to the first principal plane of the substrate 1; a thermosetting sealing resin 5 which seals at least the semiconductor element 6 and the first principal plane of the substrate 1; and a metal member provided on the second principal plane and electrically connected with the metal core layer 1a. Within the substrate 1, provided are through-holes 1b that penetrate between the first and the second principal plane. The through-holes 1b are desirably formed to electrically connect with the metal core layer.
| JPS51124377 | SEMICONDUCTOR DEVICE |
| JP7300302 | semiconductor package |
| WO/2023/100939 | TEMPORARY FASTENING MATERIAL, AND MANUFACTURING METHOD FOR JOINED BODY |
AKUTSU YASUO
HARADA MASAHIDE
UCHIYAMA KAORU
FUJIWARA SHINICHI
YOSHIDA ISAMU
| JP2005085783A | 2005-03-31 | |||
| JP2005079516A | 2005-03-24 | |||
| JP2001085554A | 2001-03-30 | |||
| JP2003046022A | 2003-02-14 |
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