To prevent noise interference to a small signal circuit by including the noise paths (NP1 and NP2) of low impedance for both of the low frequency component and high frequency component of noise.
The semiconductor device comprises a semiconductor substrate 10 for which the small signal circuit (victim circuit 10v) for handling small signals and a noise source circuit 10p are formed in different regions on the main surface side, and a package fixing the back surface side facing the main surface and covering the periphery of the semiconductor substrate 10. A first grounding body (wire 6p) for supplying a grounding potential from the main surface side to the noise source circuit 10p and a second grounding body (pad part 5p) electrically connected or capacity coupled to a part of the back surface of the semiconductor substrate 10 and physically separated from the other grounding body supplying the grounding potential to the victim circuit 10v are included in a conductor inside the package for supplying the grounding potential to the noise source circuit 10p.
ABE MASAMI
KADOYAMA TAKAHIDE
YAMADA TAKAAKI
