To protect a fringe of a resin sealed body from damage, and prevent cracks from generating in the resin sealed body, or a function of other electric parts or parts conveyer from hindering by the fragments.

This semiconductor device of a PBGA(plastic ball grid array) structure comprises a semiconductor integrated circuit chip 2 on a front surface of a wiring substrate 1, respective substrate electrodes 3 connecting electrically with respective electrodes of the semiconductor integrated circuit chip 2 via a connection wire 7, respectively, a resin sealer 8 for coating the entire front surface in order to protect the semiconductor integrated circuit chip 2, and further has a pad electrode 9 and a solder ball terminal 10 for connecting with a mother board, and further has a through hole 11 for electrically connecting the substrate electrode 3 on the front surface of the wiring substrate 1 with the pad electrode 9 on the reverse surface. A fringed part 8a of the resin sealer 8 forms a curved surface.