Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2018093074
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves downsizing and improved reliability; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a first element 11 which has an element principal surface 111 facing in a thickness direction Z and an electrode pad 112 exposed from the element principal surface 111, and which is a semiconductor element; a wiring layer 20 which is arranged opposite to the element principal surface 111 and establishes continuity with the electrode pad 112; a second element 31 mounted on the wiring layer 20; a columnar body 24 which establishes continuity with the wiring layer 20 and extends along the thickness direction Z and is arranged at a distance from the second element 31; and an encapsulation resin 4 which covers the wiring layer 20 and the second element 31. The columnar body 24 has a lateral face 241 extending along the thickness direction Z and an end face 242 crossing the lateral face 241; and the lateral face 241 is covered with the encapsulation resin 4 and the end face 242 is exposed from the encapsulation resin 4.SELECTED DRAWING: Figure 1
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Inventors:
YANAGIDA HIDEAKI
Application Number:
JP2016235689A
Publication Date:
June 14, 2018
Filing Date:
December 05, 2016
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui
Nao Usui
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