Title:
半導体装置及びその製造方法並びに電力変換装置
Document Type and Number:
Japanese Patent JP7407924
Kind Code:
B2
Abstract:
A semiconductor device (1) is provided with: a lead frame (11); a conductive adhesive (40); a semiconductor element (20); and a sealing member (36). The semiconductor element (20) is fixed onto a main surface (11a) of the lead frame (11) by using the conductive adhesive (40). The conductive adhesive (40) includes a first projection (42) separated from a lateral surface (20c) of the semiconductor element (20), and a recess (43) formed between the lateral surface (20c) of the semiconductor element (20) and the first projection (42). The first projection (42) extends about the semiconductor element (20) over a length of 50% or more of the outer periphery of the semiconductor element (20). The recess (43) is filled with a sealing member (36).
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Inventors:
Yuya Shimizu
Yasushi Nakashima
Shuhei Yokoyama
Yasushi Nakashima
Shuhei Yokoyama
Application Number:
JP2022524386A
Publication Date:
January 04, 2024
Filing Date:
May 10, 2021
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/52; H01L21/56; H01L25/07; H01L25/18
Domestic Patent References:
| JP2014179541A | ||||
| JP2019175989A | ||||
| JP2014203861A | ||||
| JP2020004784A | ||||
| JP2015188026A | ||||
| JP58196042A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office