Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE OF IT
Document Type and Number:
Japanese Patent JP3846094
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the problem caused by intrusion of a cutting water at dicing, related to a semiconductor acceleration sensor comprising a protective cap.
SOLUTION: A heat-resistant resin sheet 2 is used as a protective cap which protects a beam structure body 1a formed at a semiconductor chip 1, while the heat-resistant resin sheet 2 is bonded onto the semiconductor chip 1 with a heat-resistant bonding agent 3. A polyimide base material is used as the heat-resistant resin sheet 2 while a silicon adhesive agent is used as the heat- resistant bonding agent 3. The heat-resistant resin sheet 2 is bonded onto the semiconductor chip 1 with the heat-resistant bonding agent 3 like this so that such a problem as intrusion of cutting water is avoided at dicing cut.
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Inventors:
Shinji Yoshihara
Jun Tomo Inomata
Kinya Atsumi
Sakai Mineichi
Yasuki Shimoyama
Tetsuo Fujii
Jun Tomo Inomata
Kinya Atsumi
Sakai Mineichi
Yasuki Shimoyama
Tetsuo Fujii
Application Number:
JP6694899A
Publication Date:
November 15, 2006
Filing Date:
March 12, 1999
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/56; H01L23/29; B81B7/00; B81C1/00; B81C3/00; G01L9/04; G01P1/02; G01P15/08; H01L21/60; H01L23/02; H01L23/31; H01L23/00; (IPC1-7): H01L23/29; H01L23/31; G01L9/04; G01P15/08; H01L21/60
Domestic Patent References:
| JP10019924A | ||||
| JP10197374A | ||||
| JP7151781A | ||||
| JP3196666A | ||||
| JP5275480A | ||||
| JP5291481A | ||||
| JP6026963A | ||||
| JP6021247A | ||||
| JP7283334A | ||||
| JP9092670A | ||||
| JP10012805A |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Takahiro Miura