PURPOSE: To maintain vertical positional fixture of a semiconductor substrate even if an external anode electrode and an external cathode electrode are floated from a casing due to vibration, etc., of transporting a device.

CONSTITUTION: Leaf springs 84, 86 are interposed between a gate output electrode 80G contained in a ringlike recess 63 of an external cathode electrode 60K and a bottom of the recess 63. A semiconductor substrate 30 is pressed to an anode distortion buffer plate 50A by energizing forces of the springs 84, 86 thereto to secure vertical position of the substrate 30. Damage, deformation of the substrate in an entire pressure contact type semiconductor device can be prevented.