PURPOSE: To perfectly eliminate influence of fine particles and external air by providing a mechanism for putting or extracting a jig supporting semiconductor substrates into/from a reaction bulb and a mechanism for putting or extracting a reaction bulb into/from an electric furnace.

CONSTITUTION: A silicon wafer 2, for example, is supported by a quartz jig 1 and this jig is inserted and set one by one into a quartz tube using an automatic inserting/extracting device 4 and a cantilever 5. The quartz tube 3 is inserted into a SiC bulb 7 heated up to a high temperature in such a manner that the edge of opening side of the quartz tube 3 is pushed with the end part of cantilever 5. A wheel 8 is provided at the outside of the quartz bulb 3, a small amount of fine particles are generated by friction between the SiC bulb 7 and wheel 8 but the wafers 2 are perfectly shielded from fine particles. In case the quartz tube 3 is required to be pulled out from the SiC bulb 7 after the heat processing, it can be pulled by hooking the projected part 3a of opening of the quartz tube 3 with a part bent like a pawl of the cantilever 5. Therefore, the wafers 2 can be heat processed without any influence of external air.