Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2006059959
Kind Code:
A
Abstract:

To provide a semiconductor device comprising a shield layer capable of reducing the drop of the inductance of a spiral inductor.

The semiconductor device comprises a semiconductor substrate where an electronic circuit formed of semiconductor elements is formed, a spiral inductor formed on the semiconductor substrate, and a shield layer which is formed between the semiconductor substrate and the spiral inductor and has a plurality of openings formed radially from the center to the outer edge.


More Like This:
JP2007501513Voltage supply structure and method
JPH06101551[Title of Invention] CMOS integrated circuit device
JP3152561SEMICONDUCTOR INTEGRATED CIRCUIT
Inventors:
ANZAI NORIO
Application Number:
JP2004239305A
Publication Date:
March 02, 2006
Filing Date:
August 19, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/822; H01F17/00; H01F41/04; H01L27/04
Domestic Patent References:
JP2000022085A2000-01-21
JP2002299554A2002-10-11
JPH06181289A1994-06-28
JP2004519844A2004-07-02
JPH08172161A1996-07-02
JPH07235640A1995-09-05
JP2003243570A2003-08-29
JP2002368118A2002-12-20
JP2002353327A2002-12-06
JP2003332423A2003-11-21
JP2003133546A2003-05-09
Attorney, Agent or Firm:
Global IP Tokyo Patent Business Corporation



 
Previous Patent: STRUCTURE OF SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Next Patent: SEMICONDUCTOR LASER