Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2011124556
Kind Code:
A
Abstract:
To provide a semiconductor device with favorable characteristics and a novel structure.
The semiconductor device includes: an oxide semiconductor layer; a source electrode and a drain electrode electrically connected to the oxide semiconductor layer; a gate insulating layer covering the oxide semiconductor layer, the source electrode, and the drain electrode; and a gate electrode over the gate insulating layer. The source electrode and the drain electrode include an oxide region formed by oxidizing a side surface thereof. The oxide region of the source electrode and the drain electrode is preferably formed by plasma treatment with a high frequency power of 300 MHz to 300 GHz and a mixed gas of oxygen and argon.
Inventors:
YAMAZAKI SHUNPEI
KOYAMA JUN
KOYAMA JUN
Application Number:
JP2010248445A
Publication Date:
June 23, 2011
Filing Date:
November 05, 2010
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB
International Classes:
H01L29/786; H01L21/28; H01L21/336
Domestic Patent References:
JP2009167087A | 2009-07-30 | |||
JP2007103918A | 2007-04-19 | |||
JP2007220820A | 2007-08-30 | |||
JP2008098637A | 2008-04-24 | |||
JP2009267399A | 2009-11-12 |
Foreign References:
WO2008136505A1 | 2008-11-13 |