Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3580244
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof which is easy to handle a thinned semiconductor element.
SOLUTION: The semiconductor device 7 has a bumper 4' being a reinforcing member bonded with adhesives 5 to the backside of a semiconductor element 1' to its electrode forming surface. The element 1' is bonded to the bumper 4' deformably with the low-elastic modulus adhesives 5 easily expandable/ shrinkable after bonding. This facilitates handling the semiconductor device 7 and allows the element 1' to be deformed according to the deformation of a substrate 11 after mounting, thereby effectively relaxing thermal stresses in a heat cycle.
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Inventors:
Tadahiko Sakai
Mitsuru Ozono
Ken Maeda
Mitsuru Ozono
Ken Maeda
Application Number:
JP2000335492A
Publication Date:
October 20, 2004
Filing Date:
November 02, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/12; H01L21/60; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP10135386A | ||||
| JP555278A | ||||
| JP9213662A | ||||
| JP11214434A | ||||
| JP200068401A | ||||
| JP2000294522A | ||||
| JP200157404A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito