Title:
SEMICONDUCTOR DEVICE MEASURING METHOD
Document Type and Number:
Japanese Patent JP2016142649
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enable electrical characteristics in relation to semiconductor devices to be reliably measured even in a high-temperature measuring environment.SOLUTION: A sheet 11 is placed in advance in a tensely stretched state and, by adsorbing the sheet 11 over a mounting face 53a of a hot plate 50, the sheet 11 is prevented from unduly extended even if it is heated by the hot plate 50 to create a high-temperature measuring environment. Therefore, as positions and angles of a plurality of semiconductor devices 14 stuck to the sheet 11 are maintained invariably, electrical characteristics of the plurality of semiconductor devices can be measured even in the high-temperature measuring environment.SELECTED DRAWING: Figure 1
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Inventors:
ITO TOMOAKI
Application Number:
JP2015019112A
Publication Date:
August 08, 2016
Filing Date:
February 03, 2015
Export Citation:
Assignee:
TESETSUKU:KK
International Classes:
G01R31/26; H01L21/301
Domestic Patent References:
| JPH08330372A | 1996-12-13 | |||
| JP2011077482A | 2011-04-14 | |||
| JP2010263164A | 2010-11-18 | |||
| JPS59120423A | 1984-07-12 | |||
| JPS4968657A | 1974-07-03 | |||
| JP2014229635A | 2014-12-08 |
Foreign References:
| WO2014199993A1 | 2014-12-18 | |||
| US20100144069A1 | 2010-06-10 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa