Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011146527
Kind Code:
A
Abstract:
To prevent a laminated chip having a plurality of chips of different sizes laminated from chipping, cracking and so on.
A semiconductor device 10 includes a chip 12 and a chip 11 adjoining the chip 12 and being larger than the chip 12. A resin 13 is provided on a chip 12-side surface of the chip 11 at a part positioned outside the chip 12.
Inventors:
DOMAE SHINICHI
Application Number:
JP2010006050A
Publication Date:
July 28, 2011
Filing Date:
January 14, 2010
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L21/56; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2007012848A | 2007-01-18 | |||
| JP2002176137A | 2002-06-21 |
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
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