Title:
SEMICONDUCTOR DEVICE AND MOLDING METAL MOLD WHICH IS USED FOR MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH07221131
Kind Code:
A
Abstract:
PURPOSE: To prevent water or the like from intruding into a resin sealing part main body to provide a highly reliable semiconductor device.
CONSTITUTION: In a semiconductor device formed by resin-sealing a semiconductor element mounted on a substrate 12, the outer edges of a resin sealing part 10 with the element sealed therein are located on the insides of the outer peripheral edges of the substrate 12 and a molded item runner 14a is adhered on the substrate 12 integrally with the part 10 from the part 10 to the vicinity of the end edge of the substrate 12 and is resin-sealed. The runner 14a is broken in the vicinity of the position of the end edge of the substrate 12 and is separated from the substrate.
Inventors:
MORIMURA MASAHIRO
Application Number:
JP1442694A
Publication Date:
August 18, 1995
Filing Date:
February 08, 1994
Export Citation:
Assignee:
APIC YAMADA KK
International Classes:
B29C45/26; B29C45/02; B29C45/38; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26; B29C45/38
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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