Title:
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PACKAGING SUBSTRATE PACKAGING THE SAME
Document Type and Number:
Japanese Patent JP2006049791
Kind Code:
A
Abstract:
To provide a semiconductor device capable of suppressing a generation of crack or lifting at a bonding portion between a lower bump and an upper bump.
The semiconductor device consists of a ground metallization layer 3 formed on a semiconductor substrate 1, a lower layer bump 5x formed on the ground metallization layer 3, an upper layer bump 5y formed on the lower layer bump 5x, and a resist layer 7 coating the lower layer bump 5x. And the upper layer bump 5y consists of a pillar-shaped portion 5y1 substantially embedded inside the resist layer 7, and a bump exposing portion 5y2 formed on the pillar-shaped portion 5y1.
Inventors:
SHIMOAKA YOSHIO
Application Number:
JP2004281699A
Publication Date:
February 16, 2006
Filing Date:
September 28, 2004
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L21/60
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