PURPOSE: To obtain the subject device, having high reliability of moisture absorption and excellent in moldability, crack resistance and sealing operation efficiency in production by using an epoxy resin composition using plural curing agents in combination in a specific proportion.
CONSTITUTION: This device is obtained by sealing (A) a semiconductor element with (B) a cured product of an epoxy resin composition. The component (B) contains (i) an alicyclic type phenol resin of formula I [(n) is 1-5; R is H or a monovalent functional group] and (ii) a novolak type phenol resin of formula II [(n) is 1-8; R1 and R2 are each H or a monovalent functional group; the total amount of a tri- and a tetranuclear substances in the novolak type phenol resin is ≥90wt.% based on the whole resin]. The blending weight ratio of the components (i/ii) of the components (i) to (ii) is (1/0.25) to (1/4).
KUROYANAGI AKIHISA
KOBAYASHI HIRONORI
SAKAMOTO MASAYUKI
SAITO KIYOSHI
