Title:
SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD
Document Type and Number:
Japanese Patent JP2022117606
Kind Code:
A
Abstract:
To measure a temperature of each semiconductor element safely and accurately.SOLUTION: A semiconductor device (1) includes: a laminated substrate (3) having a plurality of circuit boards (31) formed on an upper surface of an insulating plate (30); a semiconductor element (4) having a main electrode (40) formed on its upper surface and arranged on an upper surface of a predetermined circuit board among the plurality of circuit boards; and a temperature measuring device (8) for measuring a temperature of the semiconductor element. The temperature measuring device has a cable part (80) made of an insulating optical fiber, and a temperature measuring part (81) provided at a tip of the cable part. The temperature measuring part is joined to the main electrode using a joining material (S).SELECTED DRAWING: Figure 5
Inventors:
MASUDA SHINICHI
Application Number:
JP2021014196A
Publication Date:
August 12, 2022
Filing Date:
February 01, 2021
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
G01K11/12; H01L21/66
Attorney, Agent or Firm:
Hiroyoshi Aoki
Masayuki Amada
Yoshimasa Okada
Masayuki Amada
Yoshimasa Okada