To eliminate coupling noise which propagates the interior of a substrate within an integrated circuit by a method, wherein a decoupling means having at least one decoupling circuit is provided in the second block of the integrated circuit and is connected with the lower part of the substrate and a connection pad.

A diode D1, which is arranged between blocks BC3 and BC1, is provided within a region Z1 of an integrated circuit C or in the vicinity of the block BC1 within the region Z1. Similarly, a diode D2 is also provided in the vicinity of the block BC1 between a block BC2 and the block BC1. The diodes D1 and D2, which are both connected with a dynamic ground DC via inductive connection means LD1 and MLD2, form a decoupling circuit for insulating the block BC1 from noise caused by the block BC3, and noise caused by the block BC2 and a block BC4. Accordingly, the coupling noise between a noise emitter and a noise receiver, which are provided within the same substrate, can be eliminated.