To provide a semiconductor device capable of improving adhesiveness of a resin to an internal lead.

The semiconductor device is provided with: a semiconductor chip 21; a lead frame 6 having an internal lead 15a having the semiconductor chip 21 fixed thereto, and electrically connected to the semiconductor chip 21, an internal lead 15b separated from the internal lead 15a, and electrically connected to the semiconductor chip 21, external leads 11a and 11b joined to the internal leads 15a and 15b, respectively, and each having a bent part 19, and projections 17 respectively straddling the internal leads 15a and 15b and the external leads 11a and 11b, bent in directions opposite to the external leads 11a and 11b bent at bent parts 19 with respect to surfaces of the internal leads 15a and 15b at positions adjacent to the bent parts 19 along directions respectively connecting the internal leads 15a and 15b and the external leads 11a and 11b; and a sealing resin 31 sealing the semiconductor chip 21, and partial parts of the internal leads 15a and 15b and the projections 17.