To improve the sealing resin property and wire bonding property associated with the increase of the number of elements contained in one package, the miniaturization and diversification of element shapes, etc.
A semiconductor device 1 has two or more semiconductor elements 4, 7, and 8 that are laminated and packaged onto a wiring substrate 2. Electrode pads 5, 10, and 11 for the respective semiconductor elements 4, 7, and 8 are electrically connected to a connection pad 3 on the wiring substrate 2 through metal wires 6, 12, and 13. The upper side semiconductor element 8 has part of its outer perimeter portion projecting like eaves, and the hollow part underneath the eave-shaped projecting part is filled with a filler resin 15 composed of a cured material made from liquid resin. The plurality of semiconductor elements 4, 7, and 8 are integrally sealed by a sealing resin layer 14 formed on the wiring substrate 2.
NODA MASASHI
MATSUSHIMA RYOJI
Yukio Kawahara
Satoshi Yamashita
Hideaki Suyama