SEMICONDUCTOR DEVICE

Japanese Patent JP2014192189

A

PROBLEM TO BE SOLVED: To prevent a first resin layer from being broken when a second resin layer is formed on the first resin layer.SOLUTION: The semiconductor device comprises: a semiconductor substrate having a first surface; at least one active element positioned on the first surface; a first resin layer positioned on at least the one active element; and a second resin layer covering an upper surface of the first resin layer and a side surface of the first resin layer. The semiconductor device also includes at least one electrode which is electrically connected to at least the one active element and positioned on the first surface. The first resin layer has a first opening positioned on at least the one electrode. The second resin layer may have a second opening positioned inside the first opening.

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JP2002289744	SEMICONDUCTOR PACKAGE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

YAMAZAKI YASUO

JP2013063523A

October 06, 2014

March 26, 2013

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SEIKO EPSON CORP

H01L23/12

JP2011166072A	2011-08-25
JP2004281898A	2004-10-07
JP2010177596A	2010-08-12
JP2011049606A	2011-03-10
JP2011166072A	2011-08-25
JP2008277742A	2008-11-13
JPS5795641A	1982-06-14
JPS62224037A	1987-10-02
JPS63107031A	1988-05-12

Masaaki Kamiyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe

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