Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017098394
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing breaking of wires caused by thermal expansion/contraction of a resin substrate.SOLUTION: At a surface side of a resin substrate 1, an LED element mounting metal pattern 11, a ZD element mounting metal pattern 12, a connection metal pattern 13, a wire bonding metal pattern 14, and a first dummy metal pattern 15 connected with the LED element mounting metal pattern 11 are formed. At a rear face side of the resin substrate 1, a mounting terminal metal pattern 16 and a mounting terminal metal pattern 17 are formed. The LED element mounting metal pattern 11 and the mounting terminal metal pattern 16 are electrically connected with each other, and the wire bonding metal pattern 14 and the mounting terminal metal pattern 17 are electrically connected with each other by the metal via 19. The wire bonding metal pattern 14 is sandwiched between the connection metal pattern 13 and the first dummy metal pattern 15.SELECTED DRAWING: Figure 1
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Inventors:
TACHIBANA YOSHIORI
Application Number:
JP2015228429A
Publication Date:
June 01, 2017
Filing Date:
November 24, 2015
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
H01L33/62; H01L23/12; H01L31/02
Attorney, Agent or Firm:
Shozo Igarashi