Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2685039
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a cooling means capable of simultaneously attaining the high performance and compactness and light weight of a semiconductor device.
SOLUTION: A cooling plate 6 is fixed to the surface on the opposite side to formed the surface of the bump electrode 1a of a semiconductor chip 1. The semiconductor chip 1 and the cooling plate 6 are coated with sealing resin 4 excluding the surface on the opposite side of the bonded surface of the cooling plate 6 onto the semiconductor chip 1. Furthermore, the sealing resin 4 coats the surface of a flexible resin tape 2 wherein no wiring lead 3 is formed in even thickness extending over the parts near the four end parts of the surface excluding said exposed surface 8 of the cooling plate 6. At this time, the sides of the cooling plate 6 is covered with the sealing resin 4 while the resin surface and the surface of the cooling plate 6 are made almost flush with each other.
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Inventors:
Tsuneo Nakamura
Application Number:
JP32050595A
Publication Date:
December 03, 1997
Filing Date:
December 08, 1995
Export Citation:
Assignee:
NEC
International Classes:
H01L21/60; H01L23/29; (IPC1-7): H01L21/60; H01L23/29
Domestic Patent References:
| JP2252248A | ||||
| JP6168987A | ||||
| JP982839A | ||||
| JP831869A |
Attorney, Agent or Firm:
Wakabayashi Tadashi
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