SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND THEIR MANUFACTURING METHODS

Japanese Patent JP3736639

B2

PROBLEM TO BE SOLVED: To provide a semiconductor device in which an electrical short circuit hardly occurs between a drawer and an electrode when a semiconductor chip is mounted on a substrate having a wiring pattern and which has high reliability, and to provide a method of manufacturing the same.
SOLUTION: The semiconductor device includes a substrate having a wiring pattern 30 including a plurality of leads, and the semiconductor chip mounted on the substrate so that the electrode 12 is opposed to the wiring pattern 30. The electrodes 12 are arranged so as to be divided into a plurality of first groups 310 along a plurality of parallel first straight lines 110, and to be divided into a plurality of second groups 320 along the plurality of the second straight lines 120 extended along the plurality of the second straight lines 120 extended in the direction crossed with the first straight line 110. Each of the respective leads has a connecting part opposed to the one electrode 12, an extended part extended along the first straight line 110 from the connecting part, and a drawer drawn from the extended part and extended in the direction crossed with the first straight line 110.

JP3008571	PHOTODETECTOR AND MANUFACTURE THEREOF
JPH06163632	SEMICONDUCTOR DEVICE

Hideki Yuzawa

JP2003414830A

January 18, 2006

December 12, 2003

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Seiko Epson Corporation

H01L21/60; H05K1/14; H01L23/498; H05K3/36; (IPC1-7): H01L21/60; H05K1/14; H05K3/36

JP2005093468A
JP2000323205A
JP8313925A

Inoue Ichi
Yukio Fuse
Mitsue Obuchi

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