Title:
半導体装置
Document Type and Number:
Japanese Patent JP5541349
Kind Code:
B2
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Inventors:
Hisashi Takasu
Kobayashi 敦
Kobayashi 敦
Application Number:
JP2012258499A
Publication Date:
July 09, 2014
Filing Date:
November 27, 2012
Export Citation:
Assignee:
Denso, Inc.
International Classes:
H03K17/08; H02M1/00; H02M1/08; H03K17/695
Attorney, Agent or Firm:
Patent business corporation Satow international patent firm