Title:
半導体装置
Document Type and Number:
Japanese Patent JP6711614
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device comprises in a plane along a second direction: an organic member which is arranged between a first part and a third part and composed of an organic material; a conductive member composed of a conductive material; and a fourth part which is located between the organic member and the conductive member and composed of an inorganic material, in which the fourth part is opposite to the second part in a first direction, and a distance between the second part and the fourth part in the first direction is smaller than a thickness of the organic member located between the first part and the third part in the first direction.SELECTED DRAWING: Figure 1
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Inventors:
Ukigaya Nobutaka
Application Number:
JP2015252649A
Publication Date:
June 17, 2020
Filing Date:
December 24, 2015
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2013038112A | ||||
| JP2012227328A | ||||
| JP2014072296A | ||||
| JP2014082514A | ||||
| JP2013179313A | ||||
| JP2012033894A |
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa