Title:
半導体装置
Document Type and Number:
Japanese Patent JP6719228
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing increase in power consumption.SOLUTION: A semiconductor device comprises: a signal line 1000; a reception buffer circuit 1003 connected to an end of the signal line 1000 and to which a signal is supplied from the signal line 1000; and a delay element DLN which is wired-OR connected to the end of the signal line 1000, for shaping waveform of a signal at the end of the signal line 1000.SELECTED DRAWING: Figure 1
Inventors:
Ryuichi Oikawa
Application Number:
JP2016030127A
Publication Date:
July 08, 2020
Filing Date:
February 19, 2016
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01P1/00; H01L23/12; H01L23/32; H01L25/04; H01L25/18; H03H7/01; H03H17/02; H03K5/06; H04B3/04; H04L25/02
Domestic Patent References:
| JP59218980A | ||||
| JP2006197468A | ||||
| JP2012175099A | ||||
| JP11121525A | ||||
| JP10200312A | ||||
| JP1289301A |
Foreign References:
| WO2010001456A1 | ||||
| US20110063043 |
Attorney, Agent or Firm:
Tsutsui International Patent Office