PURPOSE: To prevent the production of an improper external appearance of a semiconductor device by allowing the minimum sectional position of a pinch-off part forming a tab lead to coincide with the outside surface position of a package body, thereby reducing the exposing area of the tab lead pinch-off part to suppress the adherence of solder to the exposed surface.
CONSTITUTION: The outer surface 18a of a package body 18 is disposed at the pinch-off part 17 of a tab lead 13, and the outer surface 18 is allowed to coincide with the minimum sectional position 17a. In other words, it is constructed so that the outer surface 18a of the package body 18 is contacted with the thinnest position of the tab lead 13. Thus, the tab lead 18 is cut a the pinch-off part 17, the lead 14 is cut at the frame 11, and even if it is bent or cut, the cut surface of the lead 13 which is exposed partly at the outer surface 18a becomes the minimum sectional area position, and the exposed area becomes extremely small. Accordingly, when the lead is dipped in the solder in the solder coating of later step, the solder is hardly bonded to the exposed surface of the lead 13.
| JPS6265449 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
| JPS55158658 | TAPE CARRIER SUBSTRATE AND ITS MANUFACTURE |
OOTSUKA KENICHI
SUZUKI HIROMICHI
KITAMURA WAHEI
SATOU HAJIME
KIMOTO RIYOUSUKE
HITACHI MICROCUMPUTER ENG
| JPS505329U | 1975-01-21 |
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