SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE

Japanese Patent JP3938952

B2

PROBLEM TO BE SOLVED: To precisely recognize the semiconductor information on a semiconductor substrate or a circuit element by forming a displaying layer having recessed displaying sections which show the semiconductor information above an integrated circuit.
SOLUTION: After a first wiring layer 12 is formed on a semiconductor substrate 10 with an insulating film 11 in between, a second wiring layer 14 is formed on the wiring layer 12 with an insulating film 13 in between and, after a third wiring layer 16 is formed on the wiring layer 14 with an insulating film 15 in between, an insulating film 17 is formed on the wiring layer 16. Then a displaying layer 18 composed of an insulating film through which display sections which display the shape, position, etc., of wiring are formed is formed on the insulating film 17. Then a resist pattern 19 having openings 19a at the positions corresponding to the wiring displaying sections 20 for displaying the position, shape, etc., is formed on the displaying layer 18. Then the recessed display sections 20 are formed by etching the layer 18 by using the resist pattern 19 as a mask. Therefore, the analysis of the characteristics of the substrate 10 and a logic circuit, the change of the connecting state of the wiring of the logic circuit, etc., can be made easily.

Kayoko Yasui
Takatoshi Yasui

JP14753096A

June 27, 2007

June 10, 1996

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Matsushita Electric Industrial Co., Ltd

H01L21/02; H01L21/3205; H01L23/52; H01L23/544; (IPC1-7): H01L21/02; H01L21/3205

JP6045324A
JP7099230A
JP3016111A
JP61125041A
JP60002828U
JP7335721A

Hiroshi Maeda
Hiroshi Koyama
Ichiro Oneda

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