PURPOSE: To readily stack in multi-stage by a connection method by a solder ball or a solder bump and to be miniatured more, thinned more, and lightened more.

CONSTITUTION: In a semiconductor integrated circuit device of a stacked construction that a plurality of pellets are stacked in multi-stage, terminal parts 3, 4 of two pellets 1, 2 are connected with each other by a solder ball 5 and stacked in two stages, and further the solder ball 5 is connected with a lead 6 for an external terminal and the entire pellets 1, 2 stacked in this two-stage construction are sealed with a resin mold 7. In these pellets 1, 2, a front surface, a side surface, and a rear surface of terminal parts 3, 4 are formed with a metal material such as Al, and the terminal parts 3, 4 of these pellets 1, 2 are electrically connected with each other via the solder ball 5.