To provide a semiconductor light-emitting device which prevents cracking or chipping of a semiconductor light-emitting element, when wire bonding.
The semiconductor light-emitting device comprises a support 104; the semiconductor light-emitting element which is fixed on the support 104 via a welding material 103, has first and second electrodes (102, 106), and is made up of a semiconductor layer 101 at least including an active layer; and a wiring metal 107 which is extended from the part of the upper surface of the support 104, absent from existence of the light-emitting element, to the first electrode (106) at least formed on the upper surface of the semiconductor layer 101, of the first and second electrodes (102, 106), up to the first electrode (106). Electricity is supplied to the first electrode (106) via the wiring metal 107.
| JP2003234535A | 2003-08-22 | |||
| JP2004179641A | 2004-06-24 | |||
| JP2004048040A | 2004-02-12 | |||
| JP2000068555A | 2000-03-03 | |||
| JP2004006919A | 2004-01-08 | |||
| JP2003309289A | 2003-10-31 | |||
| JPH11191642A | 1999-07-13 | |||
| JP2003347587A | 2003-12-05 | |||
| JP2002289920A | 2002-10-04 | |||
| JPH11298048A | 1999-10-29 |
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori