To provide a semiconductor light-emitting element which is easily manufactured at a low cost, and emits a generated light at the maximum light quantity.
The semiconductor light-emitting element 1 includes: a package cup 3 having a recess portion 2 with a lead electrode 6 formed in the inner surface; a semiconductor light-emitting chip 4 disposed in the recess portion 2 of the package cup 3, wherein the semiconductor light-emitting chip 4 includes light-emitting layers 8, 9 stacked in two layers, and the light-emitting layer 9 far from the package cup 3, out of the light-emitting layers 8, 9, is electrically connected to the lead electrode 6 via a through-hole 10 formed so as to penetrate the light-emitting layer 8 near the package cup in the thickness direction.
KAMAMORI HITOSHI
OKU SADAO
FUJITA HIROYUKI
Noriharu Fujita